Welcome to the 16th CyberC -- Guangzhou , China, October 24-26, 2024!

CyberC – International Conference on Cyber-enabled distributed computing and knowledge discovery – is to promote research and collaboration on the cyber-related technology.

Call for Paper

Paper submission: EDAS, or
submit your paper to email [email protected] with a title of "CyberC 2024 Submission".
Submission due date: July 01, 2024




2024 Theme: Revolutionizing Computing and Communication in the AI Era


University of Louisville
Technical Community on Computer Communications (TCCC) of the IEEE Computer Society

All accepted papers will be published in IEEE proceedings and will be submitted to EI Compendex/Scopus for indexing.

The conference strongly encourages in-person attendance. However, authors will be allowed to present their papers virtually if they encounter difficulties attending the conference, such as travel constraints.




Technical Co-sponsors: IEEE, IEEE Computer Society, IEEE TCSIM (Technical Committee on Simulation), IEEE Communications Society (ComSoc) Technical Committee on Big Data (TCBD)

Sponsored by Technical Community on Computer Communications (TCCC) of the IEEE Computer Society

Supported by The Hong Kong University of Science and Technology (Guangzhou) (HKUST(GZ)), Honkong Zhengzhou University, Chongqing University of Posts and Telecommunications, Nanjing University of Posts & Telecommunications, Guangzhou University, and Computer and Communication Special Committee of Jiansu Computer Society.

Financially Sponsored by ZTE, Huawei, AT&T, InfoBeyond, The Hong Kong University of Science and Technology (Guangzhou) (HKUST(GZ)), Xi'an Jiaotong-Liverpool University.

SCOPES
CyberC promotes in-depth exploration of the most recent research and developments in the fields of AI, big data, distributed computing, clouds, cyber security, pervasive computing, mobile computing, Internet of Things, and other cyber-based technologies. Professors, scientists, engineers, and students in these areas are encouraged to participate. CyberC also welcomes industrial participations.


An Interview: A Professor Meets a Scientist at Cyberc




This is an interview video between Dr. Chih-Lin I, Chief Scientist, Wireless Technologies, China Mobile Research Institute, and Pro. Anup Kumar, University of Louisville, Kentucky, USA. Dr. Chih-Lin I attended CyberC for years and she presented a keynote speech on the topic of SDN/NFV via SBA&CUDU, which has been charted out as a revolutionary path towards future 5G. Prof. Kumar has given a talk of Access Control Security – Why and How Access Control Policies are Tested and Verified? You can find their PPT at the Keynote page.





Know CyberC In 20 Seconds

CyberC 2024

The 16th CyberC focuses on all aspects of distributed computing, communications, security, knowledge mining, and mobile, including but not limited to:

  • Big Data, AI and Machine Learning
  • Internet of things, localization, and distributed computing
  • Blockchain theory and applications
  • 6G and mobile computing
  • Cyber Image and Surveillance
  • Cybersecurity and network monitoring
  • Signaling processing and wireless Communications
  • IoT and cyber physical systems
  • Cloud Computing and mobile services
  • HPC and Distributed Computing
  • Sensors, ICS, Power grids, and communications
  • Cyber security and privacy, cyber trust, cyber agility, and cyber assurance

The 16th CyberC will be held in Guangzhou, China.





CyberC 2019 Keynote Speech Video by Dr. Chee Ching

Journal Submission

CyberC 2024 provides a special channel for you to submit your extended version to Journal of Sensors by MDPI. After submission of a CyberC version, you can submit an extended version to the Journal after the conference:

  • Sensors (SCI, EI, Inspec, Scopus, and MEDLINE)
  • 30%-50% extension
  • Published as Regular paper
  • First submission, first review, and first publication
  • Submission any time before April 21, 2022
Journal of Sensors is a leading Journal with an Impact Factor 3.847.

Contacts
Please contact us at [email protected] if you have any questions about participations, call for papers, paper submission, publicity, sponsorships, logistics, traveling, and others.


Technical Co-sponsored by