Call for Papers

Call for Paper
CyberC 2013: The 5th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery
Beijing, China, October 10 - 12, 2013

CyberC promotes research and development of the cyber-related technology and it is unique and significant that spans through cyber-enabled data mining and knowledge discovery, distributed and parallel computing, cyber security, cloud computing, pervasive computing, mobile computing, Internet, wireless networks, cognitive systems, cyber information process, information discovery, e-health via cyber network, e-science, web technology, and network performance and tools. The research and development in these areas have received extensive attention in both the academia and industry to provide ubiquitous services for users. Various hardware and software designs, algorithms, protocols, simulations, and test-bed, and implementations are developed for distributed computing in an interconnected and distributed network environment. The purpose of CyberC is to provide a forum for presentation and discussion of innovative ideas, research results, applications and experience from around the world as well as highlight activities in the related areas. 
CyberC 2013 (The fifth CyberC) continues the aim to provide a forum for presentation and discussion of innovative ideas, research results, applications, and experience from around the world as well as highlight activities in the related areas. The conference focuses on all aspects of distributed computing and knowledge mining and their scientific, engineering, and commercial applications. The topics of interests include, but not limited to:

Data Mining and Information Discovery
Agent-based distributed data mining algorithms
Data streaming, multimedia, stream, or web mining
Information discovery in data mining
Data mining applications for bioinformations and biometrics
Database applications and data mining
Security and information assurance in data mining
Parallel and Distributed Computing
Parallel and distributed algorithms
Resource allocation, load-balance, and management in distributed computing
Grid and cluster computing
Clouding computing
SOA, Web services, and mobile services
Web-caching, content delivery systems and data distribution systems
Web services and internet computing
Distributed systems and applications, modeling language, and software engineering for
distributed applications                         
Pervasive/ubiquitous computing and intelligence
Biological/molecular computing
Mobile and Internet Computing
Wireless ad hoc networks, wireless mesh networks, networking theory and algorithms
Wireless embedded sensor systems, body sensor, new sensing capabilities, and security
Cognitive radio and SDR
Future generation communications for 4G or beyond (WiMAX, LTE)
Peer-to-peer network computing and overlaying networks
Directional antenna and networking
FDMA/OFDMA modulations, synchronization, and power optimization
Mobile IP and Internet technology
Key, attacking models, privacy, confidentiality, and security in Mobile Wireless Networks
Communication, services, middleware, and multimedia on wireless networks
QoS, reliability, performance, and communication theory
Wireless network simulations, implementation, and applications

Cloud Computing
Autonomic, Real-Time and Self-Organizing Clouds
Architectural models for public and private cloud computing
Cloud resource management and allocation
Utility models and service pricing
New parallel / concurrent programming models for cloud computing
Scientific computation and other applications in the cloud
Workflows for cloud computing
Content Delivery Networks using Storage Clouds
Escience and Grid applications
Escience workflow management
Web semantics for Escience
Ontologies and databases for Escience
Data and process provenance
Performance and User Experience
Performance evaluation, measurement and optimization
Tools, test-bed, simulations, and experimental environments for user experience measurement
Collaborative and cooperative environments
Autonomic, reliability, and fault-tolerance
Authentication, trust, privacy and other security issues
QoS for improve user experience

Important Dates
June 14, 2013 - Conference Paper Submission Deadline
June 15, 2013 (Submission before May 15) - Notification of Acceptance/Rejection & Registration Starts

July 5, 2013 (Submission after May 15) - Notification of Acceptance/Rejection & Registration Starts
August 1, 2013 - Camera-Ready Paper Submission Due & Registration Due

Program Committee

Honorable General Chair
David Lu, AT&T Enterprise IT, USA

General Co-Chairs
Mahmoud Daneshmand, AT&T Labs, USA
Ratan Ghosh, Indian Institute of Technology, Kanpur, India

Program Co-Chairs
Bin Xie, InfoBeyond Technology LLC, USA
Min Chen, Huazhong University of Science and Technology, China

Finance Chairs
Yingbing Yu, Austin Peay State University, USA
Sanjuli Agrawal, Indiana University Southeast, USA

Workshop Co-Chairs
Chi-Tsun (Ben) Cheng, The Hong Kong Polytechnic University, Hong Kong
Tuan T. Tran, InfoBeyond Technology LLC, USA
Bing He, Cisco Systems, USA

Publicity Co-Chairs
Stephen Clyde, Utah State University, USA
Lynne Williams, Kaplan University, USA
Steven Grover, Comrise, USA 

Local Coordination Co-Chair
Jie Hu, China Telecom, China
Dongmei Sun, Beijing Jiaotong University, China

Steering Committee
Anup Kumar, (Chair) University of Louisville, USA
Ratan Ghosh, Indian Institute of Technology, Kanpur, India
Qing-An Zeng, North Carolina A&T State University, USA
Chi-Ming Chen, AT&T, USA
Liang-Jie Zhang, IBM Thomas J. Watson Research Center, USA

Technical Program Committee


Ahmed Badi, Florida Atlantic University, USA
Ali Ismail Awad, Al Azhar University, Egypt
Aniruddha Bhattacharjya, Amrita University, India
Antonio Abramo, University of Udine, Italy
Benoit Hudzia, SAP Research, UK
Cajetan M. Akujuobi, Alabama State University, USA
Donglin Wang, New York Institute of Technology, USA
Dorsaf Azzabi, Canadian University of Dubai, UAE
Eduard Babulak, King Saud University, Saudi Arabia
Fahim A. Umrani, MUET, Pakistan
Hsueh-Hsien Chang, Jin Wen University Science and Technology, Taiwan
Hsung-Pin Chang, National Chung Hsing University, Taiwan
I-Cheng Chang, National Dong Hwa University, Taiwan
Jalal Al Muhtadi, King Saud University, Saudi Arabia
Jean-Michel Dricot, UniversitéLibre de Bruxelles, Belgium
Jérôme Darmont, Université de Lyon, France
Man Ho Au, University of Wollongong, Australia
Michael Naseimo Daikpor, University of Lagos, Nigeria
Min Wu, Oracle Corporation, USA
Mohammad Shoeb khan, University of Louisville, USA
Nicolas Sklavos, Technological Educational Institute of Patras, Greece
Pijush Barthakur, Sikkim Manipal Institute of Technology, India
Ruay-Shiung Chang, National Dong Hwa University, Taiwan
S Srinivasan, Texas A & M International University, USA
Sachin Kumar Agrawal, University of Limerick, Ireland
Soheil Afraz, IAU Ardabil Branch, Iran
Subin Shen, Nanjing University of Posts & Telecommunications, China
Tiago de Carvalho, Federal Rural University of Pernambuco, Brazil
Wei Wei, Xi'an University of Technology, China
Xiaolin Chang, Beijing Jiaotong University, China
Xuewen (Sean) Gong, Huawei Technologies, China
Zhefu Shi, Microsoft, USA



Committee Secretary
Di (Debbie) Qiu, InfoBeyond Technology LLC, USA

Manuscript Guidelines


Paper Submission Web: by clicking on CyberC 2013
Paper Submission Email:
Please DO NOT submit both ways.

All submitted manuscripts should be prepared as technical papers and may not exceed 8 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text). For more information please see Submissions not conforming to these guidelines may be returned without review. The submitted manuscripts can be prepared in Word, or Latex using the IEEE templates, but authors should finally submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.

Manuscript submission procedure is available over the Web at We encourage you to use edas online submission by selecting “CyberC 2013”. If you have troubles in using the Web submission, you can also submit your paper to or contact us. Electronic submissions must be in the form of a readable PDF file. 

Submitted manuscripts have to present the original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken, including (but not limited to) notifications sent to the heads of the institutions of the authors and sponsors of the conference. Submissions received after the due date, exceeding length limit, or not appropriately structured may also not be considered.

Paper Acceptance 
Manuscripts should present the current research in the areas identified in the call for papers. All submitted manuscripts will be reviewed by experts in the fields and will be judged from the aspects of problem significance, contributions, originality, correctness, technical strength, quality of presentation, and relevance to the conference attendees. Papers will be accepted with Regular Papers and Short Papers with maximal 8 pages and 4 pages in the final version respectively. 

All accepted and presented papers, including the workshops’ papers, will be published by IEEE Computer Society's Conference Publishing Services (CPS) and will be submitted to the IEEE Xplore database. They will be further arranged for indexing through IEE INSPEC, EI (Compendex), and Thomson ISI. Authors of accepted papers, or at least one of them, should register and present their work at the conference, otherwise their papers will be removed from the digital libraries of IEEE Xplore and EI after the conference.

CyberC Facebook

CyberC Weibo

For more information about the conference, please visit  or contact us at