Program Committee
 
Honorable General Chairs
David Lu, AT&T Enterprise IT, USA
Brian J. Kim, Samsung Electronics, Korea
 
Summit/Keynote Chairs
Chi-Ming Chen, AT&T Labs, USA
Ji Hong Kim, Seoul National Univeristy, Korea
 
Program Co-Chairs
Bin Xie, InfoBeyond Technology LLC, USA
Hee Yong Youn, Sungkyunkwan University, Korea
Min Chen, Huazhong University of Science and Technology, China
 
Workshop Co-Chairs
Chi-Tsun (Ben) Cheng, The Hong Kong Polytechnic University, Hong Kong
Xiaolong Tang, InfoBeyond Technology LLC, USA
Qi Yang, Xi'an Jiaotong University, China
Yong Zhao, University of Electronic Science and Technology of China, China
 
Publicity Co-Chairs
Bin Xia, Shanghai Jiaotong University, China
Sammy Yang, Board Chinese Institute of Engineers, USA
Donghoon Lee, Korea University, Korea
Xiuhua Li, Beijing University of Posts and Telecommunications, China
Lijun Zhang, Chinese Academy of Sciences, China
 
Local Coordination Co-Chairs
Dongmei Sun, Beijing Jiaotong University, China
Yuehua Dai, Samsung Electronics, China
Hui Li, Xidian University, China
Cheolkon Jung, Xidian University, China
 
Steering Committee
Anup Kumar, (Chair) University of Louisville, USA
Chi-Ming Chen, AT&T Labs, USA
Chung-Min Chen, Iconectiv, USA
Alok Srivastava, Microsoft, USA
Jiangzhou Wang, University of Kent, UK
 
Financial Co-Chairs
Sanjuli Agrawal, Indiana University Southeast, USA
Yingbing Yu, Austin Peay State University, USA
Kyungtae Kim, Sungkyunkwan University, Korea
 
Big Data Summit Co-Chairs
Chung-Min Chen, Iconectiv, USA
Jie Hu, Zynga Inc, USA
Jean (Yujing) Liu, Comrise, USA
 
SDN&NFV Summit Co-Chair
Yiqing Zhou, Chinese Academy of Sciences, China
 
Student Volunteer Co-Chairs
Lu Liu, Beijing Jiaotong University, China
Weiqian Shi, Beijing Jiaotong University, China
Yin Zhang, Huazhong University of Science and Technology, China
 
Sansung-Xi'an Tour Chair
Yuehua Dai, Samsung Electronics, China
 
Secretary and Coordinator
Di Qiu, InfoBeyond Technology LLC, USA
 
Technical Program Committee
Abbas M. Al-Ghaili, Arab Academy for Banking & Financial Sciences, Yemen
Ahmed Badi, Florida Atlantic University, USA
AlexandreKandalintsev, University of Trento, Italy
AtillaElci, Aksaray University, Turkey
Atta urRehman Khan, University of Malaya, Malaysia
Antonio Abramo, University of Udine, Italy
Benoit Hudzia, SAP Research, UK
Bo Jiang, Intel, USA
Chen Qian, University of Kentucky, USA
Chukwuemeka David Emele, University of Aberdeen, UK
Dejing Dou, University of Oregon, USA
Ding-Yaeh Hung, WuFeng University, Taiwan
Donglin Wang, New York Institute of Technology, USA
DorsafAzzabi, Canadian University of Dubai, UAE
Ezzat Kirmani, St. Cloud State University, USA
Hsung-Pin Chang, National Chung Hsing University, Taiwan
Hufeng Zhou, Brigham and Women's Hospital and Harvard Medical School, USA
Hui Lu, Beihang University, P.R. China
I-Cheng Chang, National DongHwa University, Taiwan
Jing He, Kennesaw State University, USA
JorgDummler, Chemnitz University of Technology, Germany
Jun He, University of New Brunswick, Canada
Manar Ibrahim FawziHosny, King Saud University, Saudi Arabia
Man Ho Au, University of Wollongong, Australia
Maurizio Dusi, NEC Laboratories Europe, Germany
Min Wu, Oracle Corporation, USA
Mohammad Shoeb khan, University of Louisville, USA
Nicolas Sklavos, Technological Educational Institute of Patras, Greece
Nuno Vasco Lopes, University of Minho, Portugal
Omid Mahdi Ebadati E., THamdard University, India
Phongsak Phakamach, North Eastern University, Thailand
RajdeepBhowmik, Cisco Systems Inc., USA
Ricardo Lopes Pereira, INESC-ID/Instituto Superior Técnico, Portugal
Ricardo Rodriguez, Technological University of Ciudad Juarez, Mexico
ShanmugasundaramHariharan, TRP Engineering College, India
Song Cui, Stanford University, USA
SubinShen, Nanjing University of Posts & Telecommunications, China
Timothy W. Hnat, University of Memphis, USA
Tuan T. Tran, InfoBeyond Technology LLC, USA
Vic Grout, Glyndwr University, UK
Wei-Da Hao, Texas A&M University-Kingsville, USA
Weirong Jiang, Xilinx, USA
Xian-Hua Han, Ritsumeikan University, Japan
XinyuQue, IBM, USA
Xuewen (Sean) Gong, Huawei Technologies, China
YaserJararweh, Jordan University of Science and Technology, Jordan
ZhanlinJi, University of Limerick, Ireland
Zhefu Shi, Microsoft, USA
Zhengyu He, Google, USA
 
 
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