Smart Sensor

IWSSN 2015 CFP. pdf

Call for Paper

IWSSN 2015: The 4th International Workshop on Smart Sensor Networks

Xi’an, China, Sept 17 - 19, 2015

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With the emergence of cloud computing and big data, smart sensor networks are taking an important role that serve as the interfaces for the aforementioned systems to monitor and interact with the physical world. The aim of this workshop is to gather latest research breakthroughs in the area of sensor networks development, especially for its applications in smart power distribution systems, intelligent public transport services, pervasive health technologies, and social networks. This workshop will provide a forum for presenting and discussing the most recent advances in different aspects of smart sensor networks. The workshop will gather leading researchers from academics and industry to present their research achievements and share their experiences in developing/deploying sensor networks. Topics of interest include, but not limited to: 

• Internet of Things

• Sensor-aided Smart Grids

• Vehicular Sensor Networks

• Video Sensor Networks

• Sensor-aided Social Networks

• Cognitive Radio Sensor Networks

• Robot-aided sensor networks

• Body Sensor Networks

• Sensor-Cloud Applications

• Data Fusion in Smart Sensor Networks

• Big Data in Sensory Systems

• Human-Sensor Interactions

• Bio-Inspired Sensor Networks

• Resource Management

• Cross-Layer Design and Optimization

• Network Security


Important Dates

June 20, 2015 - Conference Paper Submission Deadline

July 15, 2015  - Notification of Acceptance & Registration Starts

August 10, 2015 - Camera-Ready Paper Submission Due & Registration Due


Technical Program Committee 

Workshop Chair

Chi-Tsun (Ben) Cheng, The Hong Kong Polytechnic University, Hong Kong


Workshop Co-Chairs

Donglin Wang, New York Institute of Technology, USA

Hongbin Chen, Guilin University of Electronic Technology, China

Qingfeng Zhou, Hefei University of Technology, China

ZhiQiang (Michael) Chen, The University of Hong Kong, Hong Kong


Technical Program Committee Members

Achintha Maddumabandara, Shaw Communications, Canada

Chatura Seneviratne, University of Calgary, Canada

Haruna Matsushita, Kagawa University, Japan

Han Zhang, South China Normal University, China

Hichem Zakaria Aichour, University of Calgary, Canada

Homin Kwon, SYSTRAN Software Inc., USA

Kia Fallahi, ABB Group, Canada

Lusheng Wang, Hefei University of Technology, China

Nuwan Ganganath, The Hong Kong Polytechnic University, Hong Kong

Qingquan Sun, Oakland University, USA

Shengli Zhang, Shenzhen University, China

Shintaro Arai, Kagawa National College of Technology, Japan

Simon Engler, University of Hawaii, USA

Sumona Mukhopadhyay, University of Calgary, Canada

Wang-Hei Ho, The Hong Kong Polytechnic University, Hong Kong

Xi Chen, State Grid Corporation of China, China

Xiaofan Liu, Southeast University, China

Xinzhi Xu, Tsinghua University, China

Yoko Uwate, University of Tokushima, Japan

Zhizhong Ding, Hefei University of Technology, China

Zhuo Chen, ICT Center, CSIRO, Sydney


Workshop Secretaries

Jing (Vicky) Wang, The Hong Kong Polytechnic University, Hong Kong

Kai-Yin (Zero) Fok, The Hong Kong Polytechnic University, Hong Kong



Authors are invited to submit original technical papers to by selecting “IWSSN 2015”. Electronic submission to with title of “IWSSN 2015 Submission” is also accepted.

Please DO NOT submit both ways.


Manuscript Guidelines

All submitted manuscripts should be prepared as technical papers and may not exceed 8 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text). For more information please see Outgoing/proceedings/. Submissions not conforming to these guidelines may be returned without review. The submitted manuscripts can be prepared in Word, or Latex using the IEEE templates, but authors should finally submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.

Manuscript submission procedure is available over the Web at We encourage you to use EDAS online submission by selecting “IWSSN 2015”. If you have troubles in using the Web submission, you can also submit your paper to or contact us. Electronic submissions must be in the form of a readable PDF file.

Submitted manuscripts have to present the original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken, including (but not limited to) notifications sent to the heads of the institutions of the authors and sponsors of the conference. Submissions received after the due date, exceeding length limit, or not appropriately structured may also not be considered.


Paper Acceptance : Manuscripts should present the current research in the areas identified in the call for papers. All submitted manuscripts will be reviewed by experts in the fields and will be judged from the aspects of problem significance, contributions, originality, correctness, technical strength, quality of presentation, and relevance to the conference attendees. Papers will be accepted with Regular Papers and Short Papers with maximal 8 pages and 4 pages in the final version respectively.

Publications: Accepted and presented papers will be included into the IEEE Conference Proceeding for publication in IEEE Computer Society CPS (Conference Publishing Services) and submitted to IEEE Xplore and CSDL. It is published in the CyberC Proceeding and you can find CyberC 2014 publication at IEEE Library, EI Database, and Google Scholar and all previous published papers from 2009 to 2013. 

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CyberC QQ 1625638480 


Contact: For more information about the conference, please visit,, or contact us at

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